June 26-28, 2023, Dresden, Germany

The SEMI 3D & Systems Summit addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration, and System-In-Package (SiP) manufacturing.

Themed Smarter Systems Through Heterogeneous Integration, this year’s event will bring together industry experts to share their insights on developments and innovations that are essential to strengthening the semiconductor industry.