OK_1 Opening Keynote 1: Building the Metaverse: Augmented Reality applications and integrated circuit challenges
Edith Beigné, Meta Reality Labs, United States
Augmented reality is a set of technologies that will fundamentally change the way we interact with our environment. It represents a merging of the physical and the digital worlds into a rich, context aware and accessible user interface delivered through a socially acceptable form factor such as eyeglasses. One of the biggest challenges in realizing a comprehensive AR experience are the performance and form factor requiring new custom silicon. Innovations are mandatory to manage power consumption constraints and ensure both adequate battery life and a physically comfortable thermal envelope. This presentation reviews Augmented Reality and Virtual Reality applications and Silicon challenges.
Edith Beigné is the Research Director of AR/VR Silicon at Meta Reality Labs where she leads research projects driving the future of AR devices. Her main research interests are low power digital and mixed-signal circuits and design with emerging technologies. Over the past 20 years, she has been focusing her research on low power and adaptive circuit techniques, exploiting new design techniques and advanced technology nodes for different applications ranging from high performance multi-processors to ultra-low power SoC, and, more recently, AR/VR applications. She is the Executive vice chair of ISSCC 2024, was the technical chair of ISSCC 2022 and part of ISSCC TPC since 2014, part of VLSI symposium TPC between 2015 and 2020. Distinguished Lecturer for the SSCS in 2016/2017, Women-in-Circuits Committee chair and JSSC Associate Editor since 2018. She visited Stanford University in 2018 to research on emerging technologies and new architectures.