W02 3D Integration: Heterogeneous 3D Architectures and Sensors
3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration. With the limits of current sub-nanometric technologies, 3D integration technology is paving the way to a wide architecture scope, with reduced cost, reduced form factor, increased energy efficiency, allowing a wide variety of heterogeneous architectures. Due to the high amount of required data and associated memory capacity, ML and AI accelerator could benefit of 3D integration not only for HPC, but also for the edge and embedded HPC. 3D integration and associated architectures are opening a wide spectrum of system solutions, from chiplet-based partitioning for High Performance Computing to various sensors such as fully integrated image sensors embedding AI features, but also but also for next generation of computing architectures: AI accelerators, InMemoryComputing, Quantum, etc.
The 3D Integration Workshop took place in DATE conference from 2009 to 2015 and took place again in 2022. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the potential capabilities offered by 3D integration.
The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.
This half-day event consists of a plenary keynote, invited talks, and regular presentations
Tentative schedule, under construction
Session Chair : Peter Ramm, Fraunhofer, Germany
14:00 – 14:30 Chiplets for AI – AI for chiplets
Paul Franzon, North Carolina State University, USA
Session 1 : Chiplet based systems
14:30 – 14:45 Occamy - A 432-core RISC-V Based 2.5D Chiplet System for Ultra-Efficient (Mini) Floating-Point Computation
Gianna Paulin, ETH-Z, Switzerland.
14:45 – 15:00 Toward industrialization of 2.5D/3D heterogeneous solutions for ASICs
Fady Abouzeid, Philippe Roche, STMicroelectronics, France.
15:00 – 15:15 Energy-Efficient Communication in 2.5D Integrated Systems
Vasilis F. Pavlidis, Aristotle University of Thessaloniki, Greece.
15:15 – 15:30 Why Advanced Packaging & 3D Integration Does Matter to Everybody
Anna Fontanelli, Monozukuri SpA, Rome, Italy
15:30 – 16:15 Coffee Break
Session 2 : Advanced 3D architecture and design methodology
16:15 – 16:30 Temperature-Aware Design of 3D-Stacked Accelerators
Ayse K. Coskun, Boston University, USA.
16:30 – 16:45 Thermally aware 3D sign-off and design enablement of 3-dies stack
Mohamed Naeim and Dragomir Milojevic, IMEC, UBL, Belgium
16:45 – 17:00 3D Integration and Advanced Packaging for Modular Quantum Computer based on Diamond Spin Qubits
Ryoichi Ishihara , TU Delft, Nederlands
17:00 – 17:15 Efficient In Sensor processing based on advanced 3D technologies
Sébastien Thuriès, CEA List, France
17:15 – 17:30 Integrating Fault Tolerance for 2.5D/3D Chiplets Using the Advanced Interface Bus (AIB)
Antoine Rouget, STMicroelectronics / CEA, LIST, Grenoble, France
17:30 – 17:45 Efficient and Reliable Hardware Architectures based on Vertical Nanowire FETs
Bastien Deveautour, Institute of Nanotechnology (INL), France
|Abstract Submission deadline|
|Notification of Acceptance|
|Presentations and posters ready||26 March 2023|
|Workshop||Wednesday, 19 April 2023 - 14:00 - 18:00|
- General co-Chairs:
- P. Vivet – CEA-LIST, IRT Nanoelec (FR)
- M. Badaroglu, Qualcomm, (BE)
- Program Chair:
- P. Ramm, Fraunhofer EMFT (GE)
- Special Session Chair
- S. Mitra, Stanford University (USA)
- Industrial Liaison Chair
- Eric Ollier, CEA-Leti, IRT Nanoelec (FR)
The 3D Integration workshop took place from 2009 to 2015 and was restarted in 2022.
- DATE 2009: https://past.date-conference.com/date09/conference/workshop-W5
- DATE 2010: https://past.date-conference.com/date10/conference/workshop-W5
- DATE 2011: https://past.date-conference.com/date11/conference/workshop-W5
- DATE 2012: https://past.date-conference.com/date12/conference/workshop-W5
- DATE 2013: https://past.date-conference.com/date13/conference/workshop-W5
- DATE 2014: https://past.date-conference.com/date14/conference/workshop-W5
- DATE 2015: https://past.date-conference.com/date15/conference/workshop-W05
- DATE 2022: https://date22.date-conference.com/workshop/w02