The time zone for all times mentioned at the DATE website is CEST – Central Europe Summer Time (UTC+1). AoE = Anywhere on Earth.

Wed, 26 Oct 2022 13:40

Promotion & Sponsorship

DATE 2023 offers numerous opportunities to get in contact with the DATE community and to advertise novel solutions.

DATE is the perfect opportunity to present and communicate your technological and business capabilities to scientific, industrial and commercial audiences at one single European event. All companies, institutions, universities, initiatives and projects that are linked to DATE as promotion partners or sponsors benefit from the additional visibility of their corporate identity, their products, services, expertise and cause.

The DATE 2023 promotion & sponsorship opportunities brochure gives you and idea of what  DATE 2023 can offer. Tailor-made packages can be arranged to suit your special requests. Feel free to contact us to discuss your needs and ideas.

We would be delighted to welcome you among our promotion partners and sponsors at DATE, and to welcome you in Antwerp for an interesting programme and effective networking.

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Thu, 20 Oct 2022 16:59

Careers Fair - Industry - Call for Submissions

Information for Students

The Young People Programme aims at bringing together Ph.D./Master Students and potential job seekers with recruiters from EDA and microelectronic companies. Interested jobseekers have the opportunity to apply to open positions which will be presented by the companies. If a student raises the interest in the position, an interview will be scheduled.


The following two classes of students are eligible:

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Thu, 20 Oct 2022 13:44

Student Teams Fair

The Student Teams Fair is an innovative initiative of DATE 2023 to bring together student teams participating to international competitions with and personnel from EDA and microelectronic companies. The Teams have the opportunity to present their activities, success stories and challenges, and to receive funding and support by the companies for their future activities.

Student teams will present their activities to the DATE 2023 attendees. Then, a poster session will follow to allow closer interaction of student teams with EDA and microelectronic companies, to allow discussion of sponsorship opportunities, e.g., in terms on monetary sponsorships, licenses, tutorials.


Student teams participating to international competitions, including but not limited to Robocup, Hyperloop and Carolo-Cup.

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Fri, 8 Jul 2022 19:20

War in the Ukraine

Dear DATE community,

We, the DATE Sponsors Committee (DSC) and the DATE Executive Committee (DEC), are deeply shocked and saddened by the tragedy currently unfolding in Ukraine, and we would like to express our full solidarity with all the people and families affected by the war.

Our thoughts also go out to everyone in Ukraine and Russia, whether they are directly or indirectly affected by the events, and we extend our deep sympathy.

We condemn Russia’s military action in Ukraine, which violates international law. And we call on the different governments to take immediate action to protect everyone in that country, particularly including its civilian population and people affiliated with its universities.

Now more than ever, our DATE community must promote our societal values (justice, freedom, respect, community, and responsibility) and confront this situation collectively and peacefully to end this nonsense war.

DATE Sponsors and Executive Committees.


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Fri, 8 Jul 2022 09:16

DATE 2023 - Call for Papers

The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware and embedded systems as well as embedded software.

The three-day event consists of a conference with regular papers, late breaking results papers and extended abstracts, complemented by timely keynotes, special days, focus sessions, embedded tutorials, half-day workshops and multi-partner project sessions. The event will also host the Young People Programme and newly introduced unplugged sessions fostering the networking and the exchange of information on relevant issues, recent research outcomes and career opportunities.

DATE 2023 is the 26th edition of an event that has always been the place for researchers, young professionals and industrial partners to meet, present their research and discuss the current development and next trends, with high emphasis on social interaction.

For its 2023 edition, DATE presents itself in a renewed format: After three years of online editions due to COVID-19, DATE 2023 focusses on interaction as well as reinforcing and rebuilding links in the community. Accordingly, we employ some substantial changes to the established format intending for significant added value for in-person participation: Rather than spreading the attendance throughout an entire week, we condense DATE to three days – and make them count! Furthermore, the vast majority of regular papers will be presented in a renewed format of technical sessions focussing on live interactions (in addition to the common full-length presentations available before, during and after the conference by video). By this, we make sure that the community can actually do what conferences are for: meeting, discussing and exchanging.

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OK_1 Opening Keynote 1: Building the Metaverse: Augmented Reality applications and integrated circuit challenges

Mon, 09:00

Edith Beigné, Meta Reality Labs, United States

Edith Beigné, Meta Reality Labs, US

Augmented reality is a set of technologies that will fundamentally change the way we interact with our environment. It represents a merging of the physical and the digital worlds into a rich, context aware and accessible user interface delivered through a socially acceptable form factor such as eyeglasses. One of the biggest challenges in realizing a comprehensive AR experience are the performance and form factor requiring new custom silicon. Innovations are mandatory to manage power consumption constraints and ensure both adequate battery life and a physically comfortable thermal envelope. This presentation reviews Augmented Reality and Virtual Reality applications and Silicon challenges.

OK_2 Opening Keynote 2: The Cyber-Physical Metaverse – Where Digital Twins and Humans Come Together

Mon, 09:45

Dirk Elias, Robert Bosch GmbH, Germany

Dirk Elias, Robert Bosch GmbH, DE

The concept of Digital Twins (DTs) has been discussed intensively for the past couple of years. Today we have instances of digital twins that range from static descriptions of manufacturing data and material properties to live interfaces to operational data of cyber physical systems and the functions and services they provide.

Currently, there are no standardized interfaces to aggregate atomic DTs (e.g., the twin of the lowest-level function of a machine) to higher-level DTs providing more complex services in the virtual world. Additionally, there is no existing infrastructure to reliably link the DTs in the virtual world to the integrated CPSs in the real world (like a car consisting of many ECUs with even more functions).

This keynote will address how the Metaverse can become the virtual world where DTs of humans and machines live and how to reliably connect DTs to the physical world. Insights in current activities of Bosch Research and its academic partners to move towards this vision will be provided.

LK_1 IEEE CEDA Distinguished Lecturer Lunchtime Keynote: Restoring the magic in design

Mon, 13:00

Jan M. Rabaey,  University of California at Berkeley, United States and imec, Belgium

Jan M. Rabaey,  University of California at Berkeley, United States and imec, BE

The emergence of “Very Large Scale Integration (VLSI)” in the late 1970’s created a groundswell of feverish innovation. Inspired by the vision laid out in Mead and Conway’s “Introduction to VLSI Design”, numerous researchers embarked on venues to unleash the capabilities offered by integrated circuit technology. The introduction of design rules, separating manufacturing from design, combined with an intermediate abstraction language (CIF) and a silicon brokerage service (MOSIS) gave access to silicon for a large population of eager designers. The magic however expanded way beyond these circuit enthusiasts and attracted a whole generation of software experts to help automate the design process, given rise to concepts such as layout generation, logic synthesis, and silicon compilation. It is hard to overestimate the impact that this revolution has had on information technology and society at large.

About fifty years later, Integrated Circuits are everywhere. Yet, the process of creating these amazing devices feels somewhat tired. CMOS scaling, the engine behind the evolution in complexity over all these decades, is slowing down and will most likely peter out in about a decade. So has innovation in design tools and methodologies. As a consequence, the lure of IC design and design tool development has faded, causing a talent shortage worldwide. Yet, at the same time, this moment of transition offers a world of opportunity and excitement. Novel technologies and devices, integrated in three-dimensional artifacts are emerging and are opening the door for truly transformational applications such as brain-machine interfaces and swarms of nanobots. Machine learning, artificial intelligence, optical and quantum computing present novel models of computation surpassing the instruction-set processor paradigm. With this comes a need again to re-invent the design process, explicitly exploiting the capabilities offered by this next generation of computing systems. In summary, it is time to put the magic in design again.

LK_2 Special Day Lunchtime Keynote: Interacting with Socially Interactive Agent

Tue, 13:00

Catherine Pelachaud, CNRS-ISIR, Sorbonne Université, France

Catherine Pelachaud, CNRS-ISIR, Sorbonne Université, FR

Our research work focuses on modeling Socially Interactive Agents, i.e. agents capable of interacting socially with human partners, of communicating verbally and non-verbally, of showing emotions. but also of adapting their behaviors to favor the engagement of their partners during the interaction. As partner of an interaction, SIA should be able to adapt its multimodal behaviors and conversational strategies to optimize the engagement of its human interlocutors. We have developed models to equip these agents with these communicative and social abilities. In this talk, I will present the works we have been conducted.

LK_3 Special Day Lunchtime Keynote: Analyze the Patient, engineer the therapy

Wed, 13:00

Liesbet Lagae, KU Leuven, Belgium

Liesbet Lagae, KU Leuven, BE

The complexity, cycle time and cost of new precision therapy workflow are a major challenge to overcome in order to achieve clinical implementation of this revolutionary type of treatments. For example, car T cells use the patient’s own immune (T-)cell adapted in a way to better fight cancer.  Chip technology can help to make these therapies more efficient, precise, and cost-effective. Over the last few decades, the semiconductor industry has grown exponentially, poised to increase value to the end-user while driving down costs by scaling. The result is the world’s highest standard in precision and high-volume production of nanoelectronics chip-based sensor solutions.  Imec has used its semiconductor process expertise and infrastructure to make significant innovations in single-use silicon biochip and microfluidic technology, creating toolboxes of on-chip functions spanning DNA sequencing, cell sorting, single cell electroporation, integrated biosensor arrays.   The solutions have until now mostly served the diagnostic market. Chip based microfluidics is a toolbox that brings its own design challenges, especially in relation to not having to reinvent the wheel every time. Hence, we try to make maximal reuse of generic fluidic building blocks developed for the diagnostic market, and we will explain how these building blocks are equally adapted for addressing the challenges in immune therapy. These existing demonstrations on chip could enable to provide smarter solutions for discrete unit operations and quality monitoring to even complete workflow integration.  Solving these challenges would enable more patients to access and benefit from the next most anticipated class of life changing therapies.

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